CS1009

http://onsemi.com

3

MAXIMUM RATINGS*

Rating

Value

Unit

Reverse Current

20

mA

Forward

10

mA

Operating Temperature Range

–40 to 105

°C

Storage Temperature Range

–65 to +150

°C

Lead Temperature Soldering:

Wave Solder (through hole styles only) (Note 1)

Reflow: (SMD styles only) (Note 2)

260 peak

230 peak

°C

°C

1. 10 second maximum

2. 60 second maximum above 183

°C.

*The maximum package power dissipation must be observed.

Characteristic

Test Conditions

Min

Typ

Max

Unit

Reverse Breakdown Voltage

2.492

2.500

2.508

V

Reverse Breakdown Voltage

0

2.492

2.500

2.508

V

Reverse Breakdown Voltage

–40

2.480

2.500

2.508

V

Reverse Breakdown Voltage

Change with Current

400

{

–

–

2.6

3.0

10

12

mV

mV

Reverse Dynamic Impedance

{

–

–

0.2

0.4

1.0

1.4

Ω

Ω

Temperature Stability

Avgerage Temperature Coefficient

0

0

–

–

–

–

–

–

mV

ppm/

°C

Long Term Stabilty

–

20

–

ppm/kHr

†

Denotes the specifications which apply over full operating temperature range.

3. Average temperature coefficient is defined as the total voltage change divided by the specified temperature range.

TYPICAL PERFORMANCE CHARACTERISTICS

Figure 3. Reverse Current vs. Reverse Voltage

Figure 4. Change in Reverse Voltage vs.

Reverse Current

0.5

1.0

1.4

1.8

2.2

2.6

0

4

812

16

20

REVERSE VOLTAGE (V)

0

1

2

3

4

5

REVERSE VOLTAGE (V)