5.4 Thermal Information: LMC6035

THERMAL METRIC(1)

LMC6035

UNIT

D (SOIC)

DGK (VSSOP) YAF (DSBGA) YZR (DSBGA)

8 PINS

8 PINS

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

122.3

149.2

103.1

93.8

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

61.4

57.7

0.5

0.5

°C/W

RθJB

Junction-to-board thermal resistance

70.1

84.1

35.4

26.3

°C/W

ψJT

Junction-to-top characterization parameter

11.4

4.4

0.3

0.3

°C/W

ψJB

Junction-to-board characterization

parameter

69.1

82.9

35.2

26.2

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

N/A

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.5 Thermal Information: LMC6036

THERMAL METRIC(1)

LMC6036

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

83.0

99.5

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

42.7

31.3

°C/W

RθJB

Junction-to-board thermal resistance

42.4

56.4

°C/W

ψJT

Junction-to-top characterization parameter

7.0

1.0

°C/W

ψJB

Junction-to-board characterization parameter

42.0

55.7

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

LMC6035, LMC6036

SNOS875H – JANUARY 2000 – REVISED DECEMBER 2024

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