PPC405GP-3BE200CZ datasheet(43/59 Pages) AMCC

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405GP – Power PC 405GP Embedded Processor

AMCC

Revision 2.03 – September 7, 2007

Data Sheet

Absolute Maximum Ratings

The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause

permanent damage to the device

Characteristic

Symbol

Value

Unit

Supply Voltage (Internal Logic)

VDD

0 to +2.7

Supply Voltage (I/O Interface)

OVDD

0 to +3.6

PLL Supply Voltage

AVDD

0 to +2.7

Input Voltage (2.5V CMOS receivers)

VIN

-0.6 to VDD + 0.6

Input Voltage (3.3V LVTTL receivers)

VIN

-0.6 to OVDD + 0.6

Input Voltage (5.0V LVTTL receivers)

VIN

-0.6 to OVDD + 2.4

Storage Temperature Range

TSTG

-55 to +150

°C

Case temperature under bias

-40 to +120

°C

Notes:

4. All specified voltages are with respect to GND.

Package Thermal Specifications

The PPC405GP is designed to operate within a case temperature range of -40°C to +85°C. Thermal resistance values for the

E-PBGA packages (leaded and lead-free) in a convection environment are as follows:

Package—Thermal Resistance

Symbol

Airflow

ft/min (m/sec)

Unit

0 (0)

100 (0.51)

200 (1.02)

35mm, 456-balls—Junction-to-Case

222

°C/W

35mm, 456-balls—Case-to-Ambient1

°C/W

27mm, 456-balls—Junction-to-Case

222

°C/W

27mm, 456-balls—Case-to-Ambient1

°C/W

25mm, 413-balls—Junction-to-Case

1.5

°C/W

25mm, 413-balls—Case-to-Ambient1

°C/W

Notes:

1. For a chip mounted on a JEDEC 2S2P card without a heat sink.

2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:

a. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.

b. TA = TC – P×θCA, where TA is ambient temperature and P is power consumption.

c. TCMax = TJMax – P×θJC, where TJMax is maximum junction temperature and P is power consumption.

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