TL496C, TL496Y

9-VOLT POWER-SUPPLY CONTROLLERS

SLVS012B – AUGUST 1978 – REVISED AUGUST 1995

4–2

POST OFFICE BOX 655303

TL496Y chip information

This chip, when properly assembled, displays characteristics similar to the TL496C. Thermal compression or

ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax= 150°C

TOLERANCES ARE

±10%

ALL DIMENSIONS ARE IN MILS

68

74

TL496Y

(2)

(6)

(1)

(3)

(4)

(7)

(5)

GND

SW

GND

T INPUT

1C INPUT

2C INPUT

FEEDBACK

(8)

OUTPUT

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)