HCTL-2017 datasheet(2/12 Pages) AVAGO

tên linh kiện	HCTL-2017

Giải thích chi tiết về linh kiện	Quadrature Decoder/Counter Interface ICs

PDF	12 Pages

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Soldering and Mounting Considerations

It is recommended to use manual soldering for HCTL-

2021/2017 launch pad devices due to the characteristics

of the material used in the launch pad design that not

allow wave soldering.

Direct mounting on printed circuit board (PCB) only is

recommended for HCTL-2021/2017 launch pad devices.

Mounting gap of 1mm between the base of the launch

pad and customer’s printed circuit board (PCB) is

required.

NOTE: Precaution is required in order to avoid bend or loose pin

during product handling.

Length (L)

Width (W)

Thickness (T)

HCTL-2017

22.86 ± 0.5 mm

12.70 ± 0.5 mm

1.67 ± 0.25 mm

HCTL-2021

27.94 ± 0.5 mm

12.70 ± 0.5 mm

1.67 ± 0.25 mm

CLK

SEL

RST

CH B

CH A

VSS

VDD

PINOUT A

VDD

CNTdec

CNTcas

CLK

SEL

U/D

RST

CH B

CH A

VSS

PINOUT B

(dimension in mm)

HCTL-2021 SHOWN

PIN DRAWING

Package Dimensions with Tolerances

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