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LT7184S bảng dữ liệu(PDF) 5 Page - Analog Devices

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Data Sheet
LT7184S
analog.com
Rev. 0
5 of 52
5
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the
product. This is a stress rating only; functional operation of the product at these or any other conditions
above those indicated in the operational section of this specification is not implied. Operation beyond the
maximum operating conditions for extended periods may affect product reliability and lifetime.
Thermal Resistance
Thermal performance is directly linked to PCB design and operating environment. Careful attention to PCB thermal
design is required.
Table 2. Thermal Resistance
PACKAGE TYPE
θJA3
θJC-TOP4
θJC-BOTTOM4
UNIT
LQFN1
31.0
29.2
2.6
(oC/Watt)
LQFN2
19.9
29.2
2.6
(oC/Watt)
1
Test Condition 1: Thermal impedance simulated values based upon use of 2S2P JEDEC FR-4 PCB 114mm x 76mm,
1.6mm thick in a one cubic foot sealed enclosure.
2
Test Condition 2: Thermal impedance simulated values based upon the demonstration board in still air.
3
θJA is the natural convection junction-to-ambient thermal resistance.
4
θJC-TOP and θJC-BOTTOM are the natural conduction junction-to-case thermal resistances.
ESD Caution
ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can
discharge without detection. Although this product features patented or proprietary
protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore,
proper ESD precautions should be taken to avoid performance degradation or loss of
functionality.



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