WLFO

Applications

f

Mobile and consumer products, baseband, RF,

analog, power management

f

ASIC, MEMS, system solutions for medical, security,

encryption, DC/DC converter, radar and automotive

f

Electro-Optical WLSiP, solutions for M2M

communication and Internet of Things (IoT)

f

Extension of the technology platform to a wider field

of application areas is ongoing

Differentiation

f

Chip size independent package design with small

package size adder

f

High degree of package design freedom, fan-out

zone adaptable to customer needs

f

No restrictions in bump pitch, covering I/O gap

between IC and PCB

f

No laminate substrate required, shorter

interconnections, excellent electrical performance

f

Lower thermal resistance compared to Flip Chip in

Package (FCiP) and conventional substrate based

BGA

f

System-in-Package on Wafer-Level (WLSiP) and

Package-on-Package (PoP) solutions

f

Smaller footprint and thinner package than FCiP

BGA, no need for underfill

f

Reliable, miniaturized high performance package

f

RoHS and REACH compliant package

f

Cost effective due to 300 mm wafer batch

processing and no need of extra interposer

f

Highly simplified supply chain and manufacturing

infrastructure

f

Better board level reliability and backside protection

compared to WLCSP

Thermal

Strongly dependent on chip size to package size ratio,

RDL line width and thickness, number and position of

I/Os, type of backside protection. Example for

reference: Package size 8 x 8 mm, chip size 5 x 5 mm

shows thermal performance Rth junction-ambient =

32.5 K/W and Rth junction-case = 6.5 K/W.

Interconnect Level

BGA

FCiP

eWLB

Resistance @ DC [mO]

76

7.5

3.2

Resistance @ 5 GHz [mO]

375

41

15

Inductance [nH]

1.100

0.052

0.018

Package Level

BGA

FCiP

eWLB

Resistance @ DC [mO]

89

22

23

Resistance @ 5 GHz [mO]

629

248

91

Inductance [nH]

1.790

0.950

0.340

Electrical

Excellent performance data compared to conventional

wirebonded BGA and FCiP with significantly reduced

package parasitics.

Due to the very low inductance values, this package

type is excellent for high speed applications, such as RF

and radar, proven up to 81 GHz.

Cross Section

Fan-out area (mold)

Chip

Redistribution Layer (RDL)

A

B

C

Solder Ball

Dielectric

UBM (in CSPnl)

D

E

F

B

C

D

E

F

A