Amkor offers a broad line of TQFP (Thin Quad Flat Pack) IC packages.

These packages allow IC packaging engineers, component specifiers

and systems designers to solve issues such as increasing board

density, die shrink programs, thin end‑product profile and portability.

TQFP

DATA SHEET | LEADFRAME PRODUCTS

Thermal Performance

Single-Layer PCB

Package

Body Size

(mm)

Pad Size

(mm)

θJA at (°C/W) by Velocity (LFPM)

0

200

500

32 Ld

7 x 7

5 x 5

69.3

57.8

52.1

64 Ld

14 x 14

8 x 8

47.0

38.1

33.9

100 Ld

14 x 14

8 x 8

43.4

35.5

31.7

Electrical Performance

Simulated Results @ 100 MHz

Package

Body Size

(mm)

Pad Size

(mm)

Lead

Inductance

(nH)

Bulk

Capacitance

(pF)

Self

Resistance

(mF)

176 Ld

20 x 20

10 x 10

Longest

Shortest

4.890

3.490

0.871

0.744

58.4

43.9

Multi-Layer PCB

Package

Body Size

(mm)

Pad Size

(mm)

θJA at (°C/W) by Velocity (LFPM)

0

200

500

32 Ld

7 x 7

5 x 5

49.5

43.8

41.3

64 Ld

14 x 14

8 x 8

35.1

29.8

27.7

100 Ld

14 x 14

8 x 8

33.4

28.5

26.4

JEDEC standard test boards

JEDEC standard test boards

Tested @ 1W

FEATURES

f

5 x 5 mm to 20 x 20 mm body size

with 1.0 mm body height

f

32‑176 lead counts

f

Broad selection of die pad sizes

available

f

Pre‑plated frames available

f

Inverted pad configuration available

f

Custom leadframe design available

f

Cu, Au and Ag wire options

f

Pb‑free and RoHS compliant materials

APPLICATIONS

Amkor’s TQFPs are an ideal

package for most IC semiconductor

technologies such as ASIC, gate

arrays (FPGA/PLD), microcontrollers

and PMIC controllers.

TQFP packages are particularly

well suited for electronic systems

applications requiring broad

performance characteristics,

including computing, video/

audio, telecommunications, data

acquisition, communication boards

(ethernet, ISDN, etc.), set‑top box and

automotive.