With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such

information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of

whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not

in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor

reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are

registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies.

© 2021 Amkor Technology, Incorporated. All Rights Reserved. DS370V-EN Rev Date: 12/21

Visit amkor.com or email sales@amkor.com for more information.

Services And Support

Amkor has a broad base of resources available to help

customers bring quality products to market quickly and

at the lowest possible cost.

f

Full package characterization

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Thermal, mechanical stress and electrical

performance modeling

f

Turnkey assembly, test and drop ship

f

World‑class reliability testing and failure analysis

Test Services

f

Program generation/conversion

f

Wafer probe

f

Burn‑in capabilities

f

‑55°C to +165°C test available

f

Strip test available

SOIC

Shipping Options

f

Clear anti‑static tube, 20 inch

f

Tape and reel

f

Dry pack

f

Drop ship

Cross Section SOIC

Configuration Options

SOIC Nominal Package Dimensions (Inches)

Package

Type

Lead

Count

Body

Width

Body

Length

Body

Thickness

Standoff

Overall

Height

Lead

Pitch

Tip-to-Tip

JEDEC

SOIC

(Narrow)

8

0.150

0.194

0.058

0.006

0.064

0.050

0.236

MS‑012

14

0.150

0.342

0.058

0.006

0.064

0.050

0.236

MS‑012

16

0.150

0.391

0.058

0.006

0.064

0.050

0.236

MS‑012

SOIC

(Wide)

16

0.300

0.407

0.092

0.009

0.101

0.050

0.406

MS‑013

20

0.300

0.505

0.092

0.009

0.101

0.050

0.406

MS‑013

Wirebond

Die attach adhesive

Mold compound

A

B

Die attach pad

Cu leadframe

C

D

E

C

A

B

E

D