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© 2020 Amkor Technology, Incorporated. All Rights Reserved. DS831F-EN Rev Date: 12/20

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Flip Chip BGA (FCBGA)

Additional Package Options

f

Wafer node : ≥ 7 nm qualified, 5 nm in qualification

f

SMT components on top or bottom side

f

Multi-die capability

f

Memory components on top side

f

Variety of lid material options

f

Grounded lid

f

Custom BGA footprints

Test Services

f

Program generation/conversion

f

Product engineering

f

Available test/handling technology

f

Burn-in capabilities

Shipping

f

Standard JEDEC trays

Body

Type

0.4 mm

0.5 mm

0.65 mm

0.8 mm

1 mm

Ball Count

10

576

361

196

121

81

11

676

441

256

144

100

12

841

529

289

196

121

13

961

625

361

225

144

14

1156

729

400

256

169

15

1296

841

484

289

196

16

1521

961

529

361

225

17

625

400

256

19

784

484

324

21

961

625

400

23

1156

729

484

25

1369

900

576

27

1024

676

29

1225

784

31

1369

900

33

1600

1024

Configuration Options

Full array ball counts (ball count shown indicates maximum package size produced to date).

Body

Type

0.4 mm

0.5 mm

0.65 mm

0.8 mm

1 mm

Ball Count

35

1764

1156

37.5

2025

1296

40

1521

42.5

1681

45

1936

47.5

2116

50

2401

52.5

2601

55

2916

57.5

3136

60

3481

62.5

4140

65

4096

66

4201

67.5

4344

85

6456

Cross Sections

Bare Die

Lidded

Stiffener Ring