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in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor

reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are

registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies.

© 2019 Amkor Technology Incorporated. All Rights Reserved. DS550V-EN Rev Date: 06/19

Visit amkor.com or email sales@amkor.com for more information.

Standard Materials

f

Package substrate

▷ Conductor: Copper

▷ Dielectric: Epoxy resin glass reinforced

f

Die attach adhesive: Low-stress elastomer

f

Encapsulant: Epoxy mold compound

f

Low-alpha material available

f

Solder balls: Pb-free

f

Wire type

▷ Copper (PCC, Au Pcc)

▷ Silver and gold (2N, 4N)

Package View

TOP VIEW

SIDE VIEW

BOTTOM VIEW

Process Highlights

f

Die thickness: 0.040-0.27 mm

f

Marking: Laser

f

Ball inspection: Optical

f

Wafer backgrinding available

f

Encapsulated SMT components available

f

Micro Pb-free covered LGA pads/LGAs available

Test Services

f

Program generation/conversion

f

Product engineering

f

Wafer sort

f

256 pin x 20 MHz test system available

f

-55°C to +165°C test available

f

Burn-in capabilities

Shipping

f

Standard JEDEC trays

f

Tape and reel

f

Dry pack

CABGA Package Thickness Capability

LFBGA

> 1.2 mm

TFBGA

1.2 mm (max)

VFBGA

1.0 mm (max)

WFBGA

0.8 mm (max)

UFBGA

0.65 mm (max)

XFBGA

0.50 mm (max)

XFBGA

0.45 mm (max)

X2FBGA

0.40 mm (max)

CA-LFBGA

CABGA-TFBGA

CTBGA/CASON

CABGA-VFBGA

CVBGA/CASON

CA-WFLGA

CASON

CA-XFBGA

CA-XFLGA

CA-XFBGA

CA-XFLGA

CA-XFBGA

CA-XFLGA

CA-X2FBGA

CA-X2FLGA

Mold Cap

Thickness

0.70 mm

0.95 mm

0.60 mm

0.53 mm

0.45 mm (BGA)

0.53 mm (LGA)

0.40 mm (BGA)

0.45 mm (LGA)

0.32/0.35 mm (BGA)*

0.40 mm (LGA)

0.25 mm (BGA)*

0.32 mm (LGA)

0.2 mm (BGA)*

0.25 mm (LGA)

0.18 mm (BGA)*

Substrate

Layer

2 Lyr

0.32 mm, 0.56 mm

4 Lyr or 6 Lyr

0.34 mm, 0.56 mm

2 Lyr or 4 Lyr

0.21 mm,

0.26 mm

2 Lyr or 4 Lyr

0.21 mm

2 Lyr

0.21 mm,

0.13 mm

2 Lyr

0.13 mm

2 Lyr

0.13 mm

2 Lyr

0.1 mm

2 Lyr

0.085 mm

Die

Thickness**

0.27 mm

0.23 mm

0.18 mm

0.13 mm

0.10 mm

0.075 mm

0.050 mm

0.040 mm

Availability

0.7 mm

All Sites

0.95 mm P3, K4

All Sites

All Sites

0.45 mm

All Sites

0.40 mm C3, K4

0.32 mm, K4, P3

0.35 mm, All Sites

0.25 mm

All Sites

0.2 mm

K4

0.18 mm

K4

*Options are available with microballs

**Die thickness is also dependent on the wirebond loop height requirement

ChipArray® CABGA/FBGA