INTERPOSERPOP datasheet(2/4 Pages) AMKOR

2 / 4 page

Applications

Interposer PoP packages are designed for products

requiring efficient memory architectures including

multiple buses and increased memory density and

performance, while reducing mounted area. Portable

electronic products such as mobile phones, portable

media players (audio/graphics processor plus memory),

gaming and other mobile applications can benefit

from the combination of stacked package and small

footprint.

Reliability Qualification

Amkor assures reliable performance by continuously

monitoring key indices.

Package Level

Moisture resistance testing: JEDEC level 3 @ 260°C x

3 reflows

uHAST: 130°C, 85% RH, 96 hours

Temp/Humidity: 85°C, 85% RH, 1000 hours

Temp cycle: -55°C/+125°C, 1000 cycles

High temp storage: 150°C, 1000 hours

Board Level

Thermal cycle: -40°C/+125°C, 1000 cycles

Interposer PoP

Standard Materials

Package laminate substrate

▷ Cored and coreless available

Chip attach

▷ Mass reflow (MR) and thermocompression (TC)

available

Encapsulant

▷ Package: Epoxy mold compound (EMC)

▷ Die: Capillary underfill (CUF)

▷ Die: Non-conductive paste (NCP)

Solder ball

▷ Pb-free (BGA side passives available)

▷ LGA

Process Highlights

Die thickness: <100 μm is available

Bump pitch: Down to 40/80 μm proven in HVM

Wafers: 200 mm & 300 mm

Test Services

Program generation/conversion

Product engineering

Dual-sided contactor system available

Tape and reel service

Shipping

JEDEC trays

Tape and reel available

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