TCXO/Crystal/FRAM

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implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

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© 2006 Maxim Integrated Products

is a registered trademark of Maxim Integrated Products, Inc.

is a registered trademark of Dallas Semiconductor Corporation.

Chip Information

SUBSTRATE CONNECTED TO GROUND

PROCESS: CMOS

Thermal Information

Theta-JA: +73°C/W

Theta-JC: +23°C/W

20

19

18

17

16

15

14

13

1

2

3

4

5

6

7

8

SCL

GND

SCL

SDA

32kHz

N.C.

WP

TOP VIEW

GND

N.C.

N.C.

N.C.

N.C.

RST

INT/SQW

12

11

9

10

N.C.

N.C.

N.C.

N.C.

SO

DS32x35

Pin Configuration

Package Information

For the latest package outline information, go to

Revision History

Rev 0; 12/06: Initial data sheet release.

Ordering Information

PART

TEMP RANGE

FRAM DENSITY

PIN-PACKAGE

MARK

DS32B35-33#

0°C to +70°C

2k x 8

20 SO

DS32B35

DS32B35-33IND#

-40°C to +85°C

2k x 8

20 SO

DS32B35

DS32C35-33#

0°C to +70°C

8k x 8

20 SO

DS32C35

DS32C35-33IND#

-40°C to +85°C

8k x 8

20 SO

DS32C35

PACKAGE

DOCUMENT NO.

20-pin SO (300 mils)

56-G4009-001

# Denotes a RoHS-compliant device that may include lead that is exempt under RoHS requirements. The lead finish is JESD97 cate-

gory e3, and is compatible with both lead-based and lead-free soldering processes. A "#" anywhere on the top mark denotes a

RoHS-compliant device.