MP6543 – 12V, 2A, THREE-PHASE POWER STAGE

MP6543 Rev. 1.01

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4

1/15/2020

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PIN FUNCTIONS (continued)

Pin #

MP6543

Name

MP6543A

Name

MP6543B

Name

Description

7

VIN

Input power.

8

LSS

Low-side source connection for phases A, B, and C. Must

be connected directly to GND.

9

SA

Phase A output.

10

SB

Phase B output.

11

SC

Phase C output.

12

LSS

Low-side source connection for phases A, B, and C. Must

be connected directly to GND.

13

VIN

Input power.

14

VCP

Charge pump output. Connect a 1µF ceramic capacitor to

VIN.

15

GND

Ground.

16

VIN_LDO

LDO input.

17

OC_ADJ

Over-current threshold programming pin.

18

V3P3

3.3V regulator output. Low-side gate driver supply voltage.

Bypass to GND with a 0.47µF ceramic capacitor.

19

N/C

No connection.

20

nFAULT

Fault indication. Open-drain output type, logic low when in

fault condition.

21

SOC

Current-sense output for phase C.

22

SOB

Current-sense output for phase B.

23

SOA

Current-sense output for phase A.

24

nSLEEP

Sleep mode input. Logic low to enter low-power sleep mode.

Internal pull-down.

ABSOLUTE MAXIMUM RATINGS (1)

Supply voltage (VIN, VIN_LDO) ......... -0.3V to +18V

VSx .......................................... -0.3V to VIN +0.3V

VCP............................................. -0.3V to VIN +5V

AGND to PGND ........................... -0.3V to +0.3V

Voltage at all other pins .................... -0.3 to +5V

Continuous power dissipation (TA = 25°C) (2)

QFN-24 (3mmx4mm)

.............................. 2.6W

Junction temperature ................................ 150°C

Lead temperature...................................... 260°C

Storage temperature.................-65

C to +150C

Recommended Operating Conditions (3)

Supply voltage (VIN) ............................ 3V to 12V

Operating junction temp (TJ).....-40°C to +125°C

Thermal Resistance (4)

θJA

θJC

QFN-24 (3mmx4mm).…..…...48 ..…10......°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX) - TA) / θJA. Exceeding the maximum allowable power

dissipation may cause excessive die temperature, and the

regulator to go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Continuous current depends on PCB layout and ambient

temperature.

5) Measured on JESD51-7, 4-layer PCB.