6 Specifications

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Voltage

VIN, EN, PWM

–0.3

6

V

SW (DC)

–0.3

VIN + 0.3

V

SW (AC, 10ns transient)

–3

9

V

FB

–0.3

5.5

V

Operating junction temperature, TJ

–40

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Theseare stress

ratings only, which do not imply functional operation of the device at these or anyother conditions beyond those indicated

under Recommended OperatingConditions. Exposure to absolute-maximum-rated conditions for extended periods mayaffect device

reliability.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safemanufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safemanufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input stage

VIN

2.5

5.5

V

VEN

–0.1

6

V

VPWM

–0.1

6

V

Output stage

VOUT

VIN

V

IOUT

1.5

A

Peripheral component

Effective inductance

2.2

4.7

μH

Effective capacitance

μF

Temperature

Operating Ambient temperature, TA

-40

85

°C

Operating Junction temperature, TJ

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

TPS92201, TPS92201A

UNIT

DRL (SOT563)

DRV (WSON-6)

6 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

152

82.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

73.1

106.5

°C/W

RθJB

Junction-to-board thermal resistance

41.3

45.8

°C/W

ψJT

Junction-to-top characterization parameter

2.1

7.7

°C/W

ψJB

Junction-to-board characterization parameter

40.7

45.7

°C/W

(1)

For more information about traditional and new thermalmetrics, see the Semiconductor and IC Package Thermal Metricsapplication

report, SPRA953.

TPS92201, TPS92201A

SLVSH40B – NOVEMBER 2023 – REVISED AUGUST 2024

www.ti.com

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