▶

Conforms to JEDEC standards.

▶

Easy insertion and withdrawal of Memory Module Board.

▶

Metal latches are highly reliable.

▶

TSOP DRAM or other components can be mounted be-

neath DM03/04 series.

DM03／04 SERIES

SO-DIMM CONNECTOR

DM0 -144 B -F

FEATURES

ORDER CODE

*Please order in multiples of the quantity per package.

①【Type】DM03：4.0mm(0.157") for mounted height DM04：5.2mm(0.205") for mounted height

②【Number of contacts】144：144pin

③【Contact plating】B：Gold plating

④【Key type】1：For 5.0V 2：For 3.3V

⑤【RoHS】F：RoHS compliant

②

④ ⑤

③

①

Material and plating

Insulator material

Glass-filled LCP(UL94V-0)

Contact material

Copper alloy

Contact plating

Gold over Nickel

Retention clip material

Copper alloy

Retention clip plating

Tin copper over Nickel

Electrical Characteristics

Current rating

0.5A per contact

Contact resistance

50mΩ max.

Dielectric withstanding voltage 250V AC for 1 minute

Insulation resistance

500MΩ min. at 250V DC

Operating temperature

-55℃ to +85°C

SPECIFICATIONS

Recommended Memory Module Board Layout

Finish for recommended contact pad

Gold plating(0.76μm min.) over Nickel Plating(2μm min.)

for 5.0V Type

for 3.3V Type

COMPONENT AREA

FRONT

COMPONENT AREA

BACK

2.5±0.05

(0.098±0.002)

2.1±0.05(0.083±0.002)

32.8±0.05(1.291±0.002)

34.9±0.05(1.374±0.002)

38.6±0.05(1.520±0.002)

32.8±0.05

(1.291±0.002)

2.5±0.05(0.098±0.002)

2.1±0.05(0.083±0.002)

2±0.05(0.079±0.002)

23.2±0.05

(0.913±0.002)

25.3±0.05(0.996±0.002)

35.3±0.05(1.390±0.002)

67.6(2.661)

63.6(2.504)

33.8(1.331)

FULL R

67.6(2.661)

2(0.079)min

4.8(0.189)

23.2±0.05(0.913±0.002)

25.7±0.05(1.012±0.002)

29±0.05

(1.142±0.002)

B

C

A

0.8±0.03

(0.031±0.001)

1±0.1

(0.039±0.004)

0.6±0.05(0.024±0.002)

1.5±0.1

(0.059±0.004)

TYPE B VOLTAGE KEY

CENTER LINE

0.75(0.030)

TYPE B VOLTAGE KEY CENTER LINE

1.5±0.1

(0.059±0.004)

0.15

OPTIONAL HOLE

2-φ2(φ0.079)

3.8(0.150)max.

3(0.118)

PATTERN

PROHIBITION AREA

Unit：mm(inch)

"A"detail

"B"detail

"C"detail