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ENC28J60-C/ML bảng dữ liệu(PDF) 89 Page - Microchip Technology

tên linh kiện ENC28J60-C/ML
Giải thích chi tiết về linh kiện  Stand-Alone Ethernet Controller with SPI Interface
PDF  96 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
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ENC28J60-C/ML bảng dữ liệu(HTML) 89 Page - Microchip Technology

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© 2006 Microchip Technology Inc.
Preliminary
DS39662B-page 87
ENC28J60
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body (QFN) –
With 0.55 mm Contact Length (Saw Singulated)
b
D2
D
PAD OUTLINE
ALTERNATE
SEE DETAIL
A1
A
DETAIL
TOP VIEW
OPTIONAL
INDEX
AREA
1
2
L
BOTTOM VIEW
n
E
METAL
PAD
ALTERNATE
EXPOSED
INDICATORS
INDEX
e
E2
(NOTE 1)
(NOTE 2)
K
Contact Width
§ Significant Characteristic
Notes:
JEDEC equivalent: MO-220
β
.009
.011
.013
0.23
0.28
0.33
Pitch
Number of Pins
Overall Width
Standoff
Overall Length
Overall Height
MAX
Units
Dimension Limits
A1
D
E
n
e
A
.000
INCHES
.026 BSC
MIN
28
NOM
MAX
.002
0.00
6.00
MILLIMETERS*
.039
MIN
28
0.65 BSC
NOM
0.05
1.00
0.90
.035
.001
0.02
Contact Length §
L
.018
.022
.024
0.45
0.55
0.65
E2
D2
Exposed Pad Width
Exposed Pad Length
.153
.167
.169
3.89
4.24
4.29
.031
0.80
5.90
6.10
.240
.236
.232
.232
.236
6.00
.240
5.90
6.10
.153
.167
4.24
.169
3.89
4.29
Contact Thickness
A3
.008 REF
0.20 REF
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
See ASME Y14.5M
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad varies according to die attach paddle size.
Contact-to-Exposed Pad
§
K.008
–
–
0.20
––
* Controlling Parameter
Revised 09-12-05
Drawing No. C04-105



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