KP CSLMM1.F1

DATASHEET

DATASHEET

16 | Version 1.1 | 2024-06-05

Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020E

0

0

s

OHA04525

50

100

150

200

250

300

50

100

150

200

250

300

t

T

˚C

S

t

t

P

t

Tp

240 ˚C

217 ˚C

245 ˚C

25 ˚C

L

Profile Feature

Symbol

Pb-Free (SnAgCu) Assembly

Unit

Minimum

Recommendation

Maximum

Ramp-up rate to preheat*)

25 °C to 150 °C

2

3

K/s

Time t

S

T

Smin to TSmax

t

S

60

100

120

s

Ramp-up rate to peak*)

T

Smax to TP

2

3

K/s

Liquidus temperature

T

L

217

°C

Time above liquidus temperature

t

L

80

100

s

Peak temperature

T

P

245

260

°C

Time within 5 °C of the specified peak

temperature T

P - 5 K

t

P

10

20

30

s

Ramp-down rate*

T

P to 100 °C

3

6

K/s

Time

25 °C to T

P

480

s

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range