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TDA9614H bảng dữ liệu(PDF) 2 Page - NXP Semiconductors

tên linh kiện TDA9614H
Giải thích chi tiết về linh kiện  Audio processor for VHS hi-fi and linear audio
PDF  60 Pages
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nhà sản xuất  PHILIPS [NXP Semiconductors]
Trang chủ  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDA9614H bảng dữ liệu(HTML) 2 Page - NXP Semiconductors

  TDA9614H Datasheet HTML 1Page - NXP Semiconductors TDA9614H Datasheet HTML 2Page - NXP Semiconductors TDA9614H Datasheet HTML 3Page - NXP Semiconductors TDA9614H Datasheet HTML 4Page - NXP Semiconductors TDA9614H Datasheet HTML 5Page - NXP Semiconductors TDA9614H Datasheet HTML 6Page - NXP Semiconductors TDA9614H Datasheet HTML 7Page - NXP Semiconductors TDA9614H Datasheet HTML 8Page - NXP Semiconductors TDA9614H Datasheet HTML 9Page - NXP Semiconductors Next Button
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1995 Mar 21
2
Philips Semiconductors
Preliminary specification
Audio processor for VHS hi-fi
and linear audio
TDA9614H
CONTENTS
1
FEATURES
2
GENERAL DESCRIPTION
3
ORDERING INFORMATION
4
BLOCK DIAGRAM
5
PINNING
6
FUNCTIONAL DESCRIPTION
6.1
Audio I/O switching
6.1.1
Input Select (InputSel)
6.1.2
Normal Select (NormSel)
6.1.3
Volume L/R; AGC
6.1.4
Audio FM Output Mute (AFOMute); Normal
Output Mute (NOMute)
6.1.5
Output Select (OutSel)
6.1.6
RF Converter Mute (RFCMute)
6.1.7
Line Select (LineSel)
6.1.8
Decoder Select (DecodeSel)
6.1.9
Headphone Select (HPSel)
6.1.10
Headphone volume
6.1.11
DC Select (DCSel)
6.2
Linear audio circuits
6.2.1
Record/loop-through
6.2.2
Playback
6.3
Audio FM circuits
6.3.1
Record/loop-through
6.3.2
Playback
6.3.3
Automatic calibration
6.3.4
PAL/NTSC mode
6.4
I2C-bus
6.5
Power-On Reset (POR); derived from digital
supply voltage VDDD
6.6
Control byte
6.7
Main select byte
6.8
Secondary select byte
6.9
Left/Right (L/R) volume byte
6.10
Headphone volume byte
6.11
Install byte
6.12
Test byte
6.13
Read byte
7
LIMITING VALUES
8
THERMAL CHARACTERISTICS
9
DC CHARACTERISTICS
10
AC CHARACTERISTICS
10.1
Record audio FM mode
10.2
Record linear audio mode
10.3
Playback Audio FM mode
10.4
Playback linear audio
11
INTERNAL CIRCUITRY
12
TEST AND APPLICATION INFORMATION
12.1
RAF I/O (pin 12)
12.2
RCCOL, RCCOR, RBPF and RFIX
(pins 59, 53, 55 and 49)
13
PACKAGE OUTLINE
14
SOLDERING
14.1
Plastic quad flat packages
14.1.1
By wave
14.1.2
By solder paste reflow
14.1.3
Repairing soldered joints (by hand-held
soldering iron or pulse-heated solder tool)
15
DEFINITIONS
16
LIFE SUPPORT APPLICATIONS
17
PURCHASE OF PHILIPS I2C COMPONENTS



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