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ADA4510-2ARMZ-R7 bảng dữ liệu(PDF) 31 Page - Analog Devices

tên linh kiện ADA4510-2ARMZ-R7
Giải thích chi tiết về linh kiện  Precision, 40 V, ±70 nV/°C, Rail-to-Rail Input and Output Op Amp with DigiTrim
PDF  32 Pages
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nhà sản xuất  AD [Analog Devices]
Trang chủ  http://www.analog.com
Logo AD - Analog Devices

ADA4510-2ARMZ-R7 bảng dữ liệu(HTML) 31 Page - Analog Devices

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Data Sheet
ADA4510-2
APPLICATIONS INFORMATION
analog.com
Rev. B | 31 of 32
chanical stresses can arise from differences of coefficient of thermal
expansion (CTE), the rate at which different materials expand when
exposed to heat. During the soldering process, the rapidly changing
high temperatures cause the packaging materials surrounding the
silicon die to expand at a different rate from the silicon. This mis-
match in expansion exerts mechanical stress on the die, which can
affect the component electrical properties and cause performance
shift if not mitigated.
By baking the PCB assembly for 30 minutes at 125°C after reflow
soldering, adverse effects of mechanical stress on the ADA4510-2
can be effectively mitigated ensuring optimal specified performance.
Figure 92 shows how the VOS of representative ADA4510-2 opera-
tional amplifiers is affected by stimulated high temperature reflow
(SHR) and subsequent post solder bake.
Figure 92. VOS Shift due to Solder Heat



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