ADA4431-1

Rev. 0 | Page 12 of 12

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-248-UEED.

1

0.50

BSC

PIN 1

INDICATOR

TOP VIEW

BOTTOM VIEW

SEATING

PLANE

INDEX

AREA

0.60

0.55

0.51

0.30

0.25

0.18

0.05 MAX

0.02 NOM

0.40 MAX

0.30 NOM

0.08 REF

3.00

BSC SQ

1.80

1.70 SQ

1.55

16

5

13

8

9

12

4

EXPOSED

PAD

Figure 20. 16-Lead Lead Frame Chip Scale Package [LFCSP_UQ]

3 mm × 3 mm Body, Ultra Thin Quad

(CP-16-12)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

Ordering Quantity

ADA4431-1YCPZ-R21

−40°C to +85°C

16-Lead LFCSP_UQ

CP-16-12

H12

250

ADA4431-1YCPZ-R71

−40°C to +85°C

16-Lead LFCSP_UQ

CP-16-12

H12

3,000

ADA4431-1YCPZ-RL1

−40°C to +85°C

16-Lead LFCSP_UQ

CP-16-12

H12

10,000

T

©2007 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D06734-0-8/07(0)

TTT