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TDA8944J bảng dữ liệu(PDF) 18 Page - NXP Semiconductors |
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TDA8944J bảng dữ liệu(HTML) 18 Page - NXP Semiconductors |
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18 / 21 page ![]() Philips Semiconductors TDA8944J 2 x 7 W stereo BTL audio amplifier Product specification Rev. 02 — 14 February 2000 18 of 21 9397 750 06861 © Philips Electronics N.V. 2000. All rights reserved. 18. Revision history Table 11: Revision history Rev Date CPCN Description 02 000214 - Product specification; second version; supersedes initial version TDA8944J-01 of 14 April 1999 (9397 750 04881). Modifications: • Table 1 on page 1: SVRR; Typ value 65 dB → added • Figure 1 on page 2: Block diagram; pin numbers changed OUT2−→ 14 and OUT2+ → 17 • Figure 2 on page 3: Pin configuration; pin numbers changed OUT2−→ 14 and OUT2+ → 17 • Section 8 “Functional description”: – Section 8.1 “Input configuration” on page 4 → added. – Section 8.2 “Power amplifier” on page 5: ........, capable of delivering a peak output current of 1.5 A → changed to 2 A. – Section 8.2.1 “Output power measurement” on page 5 → added – Section 8.2.2 “Headroom” on page 5 → added • Section 8.3 “Mode selection”: – Standby mode: VMODE >(VCC − 0.5 V) → changed to (VCC − 0.5 V) < VMODE <VCC; The power consumption of the TDA8944J will be reduced to <0.18 mW → added. – Mute mode: the DC level of the input and output pins remain on half the supply voltage → added; – 2.5 V < VMODE <(VCC − 1.5 V) → changed to 3 V < VMODE <(VCC − 1.5 V) – Section 8.3.1 “Switch-on and switch-off” on page 6 • Section 8.4 “Supply Voltage Ripple Rejection (SVRR)” on page 6 → added • Section 8.5 “Built-in protection circuits” on page 6 → added • Table 5 on page 7: – Ptot value added 18 V – VCC(sc) value added 15 V • Table 6 on page 7: – Rth(j-a) value added 40 K/W – Rth(j-c) value 10 → changed to 6.9 K/W; condition ‘in free air’ → changed to ‘both channels driven’ • Table 7 on page 7: VMODE - mute mode - value Min 2.5 → changed to 3 V • Table 8 on page 8: – SVRR; Typ values 65 and 60 dB → added – α cs; Typ value 75 dB → added • Figure 3 to 13: figures added • Section 13 “Internal circuitry” on page 12: → added • Figure 14: figure adjusted • Section 14.1 “Printed-circuit board (PCB)” on page 13: → added • Figure 15: figure added • Section 14.2 “Thermal behaviour and heatsink calculation” on page 15: → added • Section 15.2 “Test conditions” on page 15: → added 01 990414 - Preliminary specification; initial version. |
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