DSPIC33FJ256GP710 datasheet(4/10 Pages) MICROCHIP

4 / 10 page

dsPIC33F

DS80279B-page 4

Module: 10-bit ADC

When the ADC module is configured for 10-bit

operation, the specifications in the data sheet are

not met for operation above 500 Ksps.

For 500 Ksps, the module meets specifications

except for Gain and Offset parameters AD23bb

and AD24bb.

For 600 Ksps operation, the module specifications

are shown in Table 2.

Work around

None. Future versions of the silicon will support

the ADC performance stated in the data sheet.

TABLE 2:

600 KSPS OPERATION

Module: DMA Module: Interaction with

EXCH

Instruction

The EXCH instruction does not execute correctly

when either of the two operands is numerically

equal to the address of any of the DMAC SFRs for

this revision of silicon.

Work around

If writing source code in assembly, the

recommended fix is to replace:

EXCH Wsource, Wdestination

with:

PUSH Wdestination

MOV Wsource, Wdestination

POP Wsource

If using the MPLAB C30 C compiler, check the dis-

assembly listing (View>Disassembly Listing) for

the EXCH instruction. If used, make sure the oper-

ands are not equivalent to the DMA SFRs’

addresses.

Param No.

Symbol

Min

Typ

Max

Units

Conditions

AD17

RIN

—

200

Ohm

10-bit

ADC Accuracy – Measurements taken with External VREF+/VREF-

AD20b

—

10 bits

—

Bits

AD21b

INL

-2

—

LSB

AD22b

DNL

-1.5

—

LSB

AD23b

GERR

LSB

AD24b

EOFF

LSB

ADC Accuracy – Measurements taken with Internal VREF+/VREF-

AD21bb

INL

-2

—

LSB

AD22bb

DNL

-1.5

—

LSB

AD23bb

GERR

LSB

AD24bb

EOFF

LSB

Dynamic Performance

AD33b

FNYQ

—

300

KHz

AD34b

ENOB

8.5

9.7

9.8

Bits

ADC Conversion Rate

AD56b

FCNV

—

600

Ksps

AD57b

TSAMP

—

3 TAD

——

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