MCP1612-ISLASHMS datasheet(5/22 Pages) MICROCHIP

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DS21921B-page 5

MCP1612

TEMPERATURE SPECIFICATIONS

Protection Features

Undervoltage Lockout

UVLO

2.4

2.55

2.7

Note 2

Undervoltage Lockout Hysteresis

UVLO-HYS

—

200

—

Thermal Shutdown

TSHD

—

160

—

°C

Note 1

Thermal Shutdown Hysteresis

TSHD-HYS

—9

—

°C

Interface Signal (SHDN)

Logic-High Input

VIN-HIGH

——

% of VIN

Logic-Low Input

VIN-LOW

——

% of VIN

Electrical Specifications: VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF. TA = -40°C to +125°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Storage Temperature Range

-65

—

+150

°C

Continuous

Maximum Junction Temperature

—

+150

°C

Transient Only

Operating Junction Temperature Range

- 40

—

+ 125

°C

Continuous Operation

Thermal Package Resistances

Thermal Resistance, 8L-MSOP

θJA

—

208

—

°C/W

Typical 4-layer board interconnecting

vias

Thermal Resistance, 8L-DFN

θJA

—

°C/W

Typical 4-layer board interconnecting

vias

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, VIN = VCC = VSHDN = 3.3V, VOUT = 1.8V, CIN = COUT = 10 µF, L = 3.3 µH,

ILOAD = 100 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note

The integrated MOSFET switches have an integral diode from the LX pin to VIN and from LX to PGND. In cases where

these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not

able to regulate the junction temperature for these cases.

UVLO is specified for a falling VIN. Once the UVLO is activated, the UVLO-HYS must be overcome before the device will

return to operation.

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