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TC1301A-ADAVMF bảng dữ liệu(PDF) 22 Page - Microchip Technology |
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TC1301A-ADAVMF bảng dữ liệu(HTML) 22 Page - Microchip Technology |
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22 / 28 page ![]() TC1301A/B DS21798B-page 22 © 2005 Microchip Technology Inc. 8-Lead Plastic Dual Flat No Lead Package (MF) 3x3x0.9 mm Body (DFN) Exposed Pad Length Exposed Pad Width Contact Length Contact Width Overall Width D2 E2 L b D .019 .012 .008 .063 .053 .010 .118 BSC Number of Pins Standoff Contact Thickness Overall Length Overall Height Pitch p n Units A A1 E A3 8 .000 .001 .008 REF. .118 BSC .031 .026 BSC MIN INCHES NOM 0.48 0.26 0.30 .022 .073 .015 .063 0.20 1.60 1.34 0.55 0.37 1.85 1.59 0.02 0.80 3.00 BSC 3.00 BSC 0.20 REF. 0.65 BSC MILLIMETERS* .002 .039 0.00 MIN MAX NOM 8 0.05 1.00 MAX n 0.90 .035 (Note 3) (Note 3) .059 .069 1.75 1.49 D2 E *Controlling Parameter Drawing No. C04-062 Notes: Exposed pad dimensions vary with paddle size. A1 A A3 Dimension Limits TOP VIEW EXPOSED METAL PAD BOTTOM VIEW 2 1 ID INDEX PIN 1 D L E2 p b n 3. Package may have one or more exposed tie bars at ends. 1. AREA Pin 1 visual index feature may vary, but must be located within the hatched area. 2. (NOTE 2) TIE BAR (NOTE 1) EXPOSED 4. JEDEC equivalent: MO-229 Revised 05/24/04 |
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