DAC−08 SERIES

http://onsemi.com

13

ORDERING INFORMATION

Device

Description

Temperature Range

DAC−08ED

16−Pin Plastic Small Outline Package

0 to +70

°C

48 Units/Rail

DAC−08EDG

16−Pin Plastic Small Outline Package

(Pb−Free)

0 to +70

°C

48 Units/Rail

DAC−08EDR2

16−Pin Plastic Small Outline Package

0 to +70

°C

2500 Tape & Reel

DAC−08EDR2G

16−Pin Plastic Small Outline Package

(Pb−Free)

0 to +70

°C

2500 Tape & Reel

DAC−08CN

16−Pin Plastic Dual In−Line Package

0 to +70

°C

25 Units/Rail

DAC−08CNG

16−Pin Plastic Dual In−Line Package

(Pb−Free)

0 to +70

°C

25 Units/Rail

DAC−08EN

16−Pin Plastic Dual In−Line Package

0 to +70

°C

25 Units/Rail

DAC−08ENG

16−Pin Plastic Dual In−Line Package

(Pb−Free)

0 to +70

°C

25 Units/Rail

DAC−08HN

16−Pin Plastic Dual In−Line Package

0 to +70

°C

25 Units/Rail

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

MARKING DIAGRAMS

SOIC−16

D SUFFIX

CASE 751B

PDIP−16

N SUFFIX

CASE 648

A

= Assembly Location

WL

= Wafer Lot

YY, Y

= Year

WW

= Work Week

G

= Pb−Free Package

DAC−08EDG

AWLYWW

DAC−08CN

AWLYYWWG

DAC−08EN

AWLYYWWG

DAC−08HN

AWLYYWWG

16

1

16

1

16

1