TC72 datasheet(18/24 Pages) MICROCHIP

tên linh kiện	TC72

Giải thích chi tiết về linh kiện	Digital Temperature Sensor with SPI??Interface

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nhà sản xuất	MICROCHIP [Microchip Technology]

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18 / 24 page

TC72

DS21743A-page 18

 2002 Microchip Technology Inc.

8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN)

Exposed Pad Length

Thermal Via Diameter

*Controlling Parameter

Termal Via Pitch

Drawing No. C04-2062

Exposed Pad Width

.012

.130

.047

Terminal Land Pattern I.D.

Terminal Land Width

Terminal Land Length

Terminal Land Pattern O.D.

Terminal Pitch

Units

Dimension Limits

.057

.134

.026 BSC

MIN

INCHES

NOM

0.30

1.20

3.30

3.40

0.65 BSC

MILLIMETERS*

.060

.157

1.45

MIN

MAX

NOM

1.53

4.00

MAX

THERMAL VIAS

ON 4 LAYER

PC BOARD

DFN LAND PATTERN

OPTIONAL TWO LAYER

PCB LAND PATTERN

OPTIONAL FOUR LAYER

0.42

0.35

.014

.017

.033

.035

0.85

0.88

1.50

1.45

.059

.057

Exposed Pad Clearance

.006

0.15

(Note 1)

Exposed pad dimensions vary with paddle size.

Notes:

Interior Lead Clearance

.071

1.80

Optional Exposed Pad Length

.130

3.30

TYPCAL SOLDER MASKS

Minimum Solder Mask Clearance

.002

0.05

M (TYP)

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