24C01SC-SLASHWF08 datasheet(9/16 Pages) MICROCHIP

9 / 16 page

 2004 Microchip Technology Inc.

DS21170E-page 9

24C01SC/24C02SC

7.0

PAD DESCRIPTIONS

TABLE 7-1:

PAD FUNCTION TABLE

7.1

SDA Serial Address/Data Input/

Output

This is a bidirectional pad used to transfer addresses

and data into and data out of the device. It is an open

drain terminal, therefore the SDA bus requires a pull-up

resistor to VCC (typical 10K¾ for 100 kHz, 2 K¾ for

400 kHz).

For normal data transfer SDA is allowed to change only

during SCL low. Changes during SCL high are

reserved for indicating the Start and Stop conditions.

7.2

SCL Serial Clock

This input is used to synchronize the data transfer from

and to the device.

7.3

DC Don’t Connect

This pad is used for test purposes and should not be

bonded out. It is pulled down to VSS through an internal

resistor.

8.0

DIE CHARACTERISTICS

Figure 8-1 shows the die layout of the 24C01SC/02SC,

including bondpad positions. Table 8-1 shows the

actual coordinates of the bondpad midpoints with

respect to the center of the die.

FIGURE 8-1:

DIE LAYOUT

TABLE 8-1:

BONDPAD COORDINATES

Name

Function

VSS

Ground

SDA

Serial Address/Data I/O

SCL

Serial Clock

VCC

+4.5V to 5.5V Power Supply

Don’t connect

Pad Name

Pad Midpoint,

X dir.

Pad Midpoint,

Y dir.

VSS

-495.000

749.130

SDA

-605.875

-271.875

SCL

479.875

-746.625

VCC

605.875

-261.375

Note 1:

Dimensions are in microns.

Center of die is at the 0,0 point.

PDIP

SDA

VCC

SCL

VSS

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