SCA3000 Assembly Instructions

1.

Molding of package

2.

Laser structuring of areas to be metallized

3.

Cu-plating of lasered areas

4.

Final plating over copper

Figure 2.

Manufacturing process for the LDS – Molded Interconnect Device.

The solder pads of a MID package are rougher than the pads of traditional lead frame packages. A

photo of a MID package solder pad is presented in figure 3. The rougher surface of the solder pad

can produce more voids in the solder joints, which is also observed in guidelines of this technical

note.

Figure 3. Photo of a MID solder pad. Surface is rougher than with traditional SMD components.

Because the MID platform represents the latest in surface mount packaging technology, it is

important that the design of the printed wiring board, as well as the assembly process, follows the

suggested guidelines outlined in this document.

VTI Technologies Oy

Subject to changes

4/15

www.vti.fi

TN54

Rev.C