DATA SHEET

www.onsemi.com

 Semiconductor Components Industries, LLC, 2018

February, 2024 − Rev. 4

1

Publication Order Number:

ESDM2032/D

ESD Protection Diode

Micro−Packaged Diodes for ESD Protection

ESDM2032

The ESDM2032 is designed to protect voltage sensitive components

that require low capacitance from ESD and transient voltage events.

Excellent clamping capability, low capacitance, low leakage, and fast

response time, make these parts ideal for ESD protection on designs

where board space is at a premium.

Features

 Low Clamping Voltage

 Small Body Outline Dimensions: 0.60 mm x 0.30 mm

 Low Body Height: 0.20 mm

 Stand−off Voltage: 3.3 V

 IEC61000−4−2 Level 4 ESD Protection

 These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Typical Applications

 mSD Card Protection

 Audio Line

 GPIO

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

IEC 61000−4−2 (ESD)

Contact

Air

30

30

kV

Total Power Dissipation on FR−5 Board

(Note 1) @ TA = 25C

Thermal Resistance, Junction−to−Ambient

PD

RqJA

313

400

mW

C/W

Junction and Storage Temperature Range

TJ, Tstg

−55 to +150

C

Lead Solder Temperature − Maximum

(10 Second Duration)

TL

260

C

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. FR−5 = 1.0 x 0.75 x 0.62 in.

See Application Note AND8308/D for further description of survivability specs.

Device

Package

Shipping†

ORDERING INFORMATION

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

ESDM2032MX4T5G

X4DFN2

(Pb−Free)

10000 / Tape &

Reel

MARKING

DIAGRAM

1

2

F

= Device Code

X4DFN2 (0201)

CASE 152AX

F