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ESDL2011 bảng dữ liệu(PDF) 1 Page - ON Semiconductor

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DATA SHEET
www.onsemi.com
 Semiconductor Components Industries, LLC, 2017
February, 2024 − Rev. 3
1
Publication Order Number:
ESDL2011/D
ESD Protection Diode
Micro−Packaged Diodes for ESD Protection
ESDL2011
The ESDL2011 is designed to protect voltage sensitive components
that require low capacitance from ESD and transient voltage events.
Excellent clamping capability, low capacitance, low leakage, and fast
response time, make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its low capacitance, the
part is well suited for use in high speed data line applications.
Features
 Low Capacitance 0.17 pF (Typ)
 Low Clamping Voltage
 Small Body Outline Dimensions: 0.60 mm x 0.30 mm
 Low Body Height: 0.2 mm
 Stand−off Voltage: 1.0 V
 IEC61000−4−2 Level 4 ESD Protection
 These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
 USB 3.x
 Thunderbolt 3.0
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 61000−4−2 (ESD)
Contact
Air
15
15
kV
Total Power Dissipation on FR−4 Board
(Note 1) @ TA = 25C
Thermal Resistance, Junction−to−Ambient
PD
RqJA
313
400
mW
C/W
Junction and Storage Temperature Range
TJ, Tstg
−55 to +150
C
Lead Solder Temperature − Maximum
(10 Second Duration)
TL
260
C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 = 28 mm2 1 oz. Cu JEDEC JESD51−3 two layer PCB.
See Application Note AND8308/D for further description of survivability specs.
Device
Package
Shipping†
ORDERING INFORMATION
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
ESDL2011PFCT5G
DSN2
(Pb−Free)
10000 / Tape &
Reel
DSN2
(Side wall isolated)
CASE 152AX
MARKING
DIAGRAM
12
A
= Specific Device Code
A


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