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AD3552R bảng dữ liệu(PDF) 10 Page - Analog Devices

tên linh kiện AD3552R
Giải thích chi tiết về linh kiện  Single Channel, 12-/16-Bit, 16 MUPS, Multispan, Multi-IO SPI DAC
PDF  59 Pages
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Trang chủ  http://www.analog.com
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Data Sheet
AD3541R
ABSOLUTE MAXIMUM RATINGS
analog.com
Rev. A | 10 of 59
TA = 25°C, unless otherwise noted.
Table 5.
Parameter
Rating
AVDD to AGND
−0.3 V to +6 V
DVDD to DGND
−0.3 V to +2.1 V
AGND to DGND
−0.3 V to +0.3 V
VLOGIC to DGND
−0.3 V to DVDD + 0.3 V or
+2.1 V (whichever is less)
PVDD to PVSS
−0.3 V to +11 V
VREF to AGND
−0.3 V to +3 V
RFBx_y to AGND
−18 V to +18 V
Digital Input Voltage to DGND
−0.3 V to VLOGIC + 0.3 V or +2.1 V
(whichever is less)
Operating Temperature Range
Industrial
−40°C to +105°C
Storage Temperature Range
−65°C to +150°C
Maximum Junction Temperature (TJ)
125°C
Power Dissipation
(Maximum TJ − TA)/θJA
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operat-
ing conditions for extended periods may affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operation environment. Careful attention to PCB
thermal design is required.
θJA is the natural convection junction to ambient thermal resistance.
θJC is the junction to case thermal resistance. Both θJA and θJC
are defined by the JEDEC JESD51 standard, and their values are
dependent on the test board and test environment.
Table 6. Thermal Resistance1
Package Type
θJA
θJC
Unit
CP-28-15
54
12
°C/W
1 Simulation values on JEDEC 2S2P board, still air (0 m/sec airflow).
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Charged devi-
ces and circuit boards can discharge without detection. Although
this product features patented or proprietary protection circuitry,
damage may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to avoid
performance degradation or loss of functionality.



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