Philips Semiconductors

Product specification

SA5217

Postamplifier with link status indicator

1998 Oct 07

8

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

1

2

3

4

5

6

7

8

9

10

11

12

13

14

LED

CPKDET

THRESH

GNDA

FLAG

JAM

VCCD

VCCA

GNDD

TTLOUT

IN1B

IN1A

CAZP

CAZN

OUT2B

IN8B

OUT2A

IN8A

RHYST

RPKDET

GND

GND

GND

OUT1

GND

GND

OUT2

VCC1

VCC2

NC

IIN

NC

GND

GND

R2

220

D1

LED

C11

100pF

100pF

C7

.01

µF

47

µF

C1

C2

GND

+VCC

0.1

µF

0.1

µF

0.1

µF

R4

4k

R3

33k

VOUT (TTL)

L3

10

µH

L2

10

µH

C12

C13

.01

µF

.01

µF

C14

C15

10

µF

10

µF

C8

C9

C10

L1

10

µH

BPF31

OPTICAL

INPUT

R1

100

C5

1.0

µF

C6

.01

µF

.01

µF

C4

10

µF

C3

NOTE:

THE NE5210/NE5217 combination can operate at data rates in excess of 100Mb/s NRZ

R5

10k

SD00359

Figure 6. A 50Mb/s Fiber Optic Receiver

For more information on this application, please refer to Application

Brief AB1432.

Die Sales Disclaimer

Due to the limitations in testing high frequency and other parameters

at the die level, and the fact that die electrical characteristics may

shift after packaging, die electrical parameters are not specified and

die are not guaranteed to meet electrical characteristics (including

temperature range) as noted in this data sheet which is intended

only to specify electrical characteristics for a packaged device.

All die are 100% functional with various parametrics tested at the

wafer level, at room temperature only (25

°C), and are guaranteed to

be 100% functional as a result of electrical testing to the point of

wafer sawing only. Although the most modern processes are

utilized for wafer sawing and die pick and place into waffle pack

carriers, it is impossible to guarantee 100% functionality through this

process. There is no post waffle pack testing performed on

individual die.

Since Philips Semiconductors has no control of third party

procedures in the handling or packaging of die, Philips

Semiconductors assumes no liability for device functionality or

performance of the die or systems on any die sales.

Although Philips Semiconductors typically realizes a yield of 85%

after assembling die into their respective packages, with care

customers should achieve a similar yield. However, for the reasons

stated above, Philips Semiconductors cannot guarantee this or any

other yield on any die sales.