MPX5100

Sensors

Freescale Semiconductor

3

ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING

Figure 2 shows the sensor output signal relative to

pressure input. Typical, minimum, and maximum output

curves are shown for operation over a temperature range of

0× to 85×C using the decoupling circuit shown in Figure 4.

The output will saturate outside of the specified pressure

range.

Figure 3 illustrates both the Differential/Gauge and the

Absolute Sensing Chip in the basic chip carrier (Case 867). A

fluorosilicone gel isolates the die surface and wire bonds from

the environment, while allowing the pressure signal to be

transmitted to the sensor diaphragm.

The MPX5100 series pressure sensor operating

characteristics, and internal reliability and qualification tests

are based on use of dry air as the pressure media. Media,

other than dry air, may have adverse effects on sensor

performance and long-term reliability. Contact the factory for

information regarding media compatibility in your application.

Figure 2. Output Vs. Pressure Differential

Figure 3. Cross Sectional Diagrams (Not to Scale)

Figure 4 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

Figure 4. Recommended Power Supply Decoupling and Output Filtering

(For additional output filtering, please refer to Application Note AN1646.)

7. Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when sugected to

a specified step change in pressure.

8. Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.

9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

5

4

3

MAX

2

1

0

Offset

Pressure (kPa)

(Typ)

MIN

TYP

PE = 2.5

TM = 1

TEMP = 0 to 85°C

Fluorosilicone

Gel Die Coat

Wire Bond

Lead Frame

Die

Epoxy Plastic

Case

Differential/Gauge Element

Die Bond

Fluorosilicone Gel

Die Coat

Wire Bond

Lead Frame

Die

Stainless Steel

Metal Cover

Epoxy Plastic

Case

Die Bond

Absolute Element

Stainless Steel

Metal Cover

470 pF

Vs

+5.0 V

0.01

µF

GND

IPS

OUTPUT

1.0

µF

IPS

OUTPUT