MPX2010 datasheet(4/14 Pages) FREESCALE

4 / 14 page

MPX2010

Sensors

Freescale Semiconductor

ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION

Figure 2. Output vs. Pressure Differential

Figure 2 shows the output characteristics of the MPX2010/

MPXV2010G series at 25°C. The output is directly

proportional to the differential pressure and is essentially a

straight line.

The effects of temperature on full scale span and offset are

very small and are shown under Operating Characteristics.

This performance over temperature is achieved by having

both the shear stress strain gauge and the thin-film resistor

circuitry on the same silicon diaphragm. Each chip is

dynamically laser trimmed for precise span and offset

calibration and temperature compensation.

Figure 3. Unibody Package: Cross Sectional Diagram (Not to Scale)

Figure 3 illustrates the differential/gauge die in the basic

chip carrier (Case 344). A silicone gel isolates the die surface

and wire bonds from the environment, while allowing the

pressure signal to be transmitted to the silicon diaphragm.

The MPX2010/MPXV2010G series pressure sensor

operating characteristics and internal reliability and

qualification tests are based on use of dry air as the pressure

media. Media other than dry air may have adverse effects on

sensor performance and long term reliability. Contact the

factory for information regarding media compatibility in your

application.

Offset

(Typical)

kPa

PSI

2.5

0.362

0.725

7.5

1.09

1.45

Span

Range

(Typical)

VS = 10 Vdc

TA = 25°C

P1 > P2

–5

TYP

aMAX

MIN

Silicone

Die Coat

Die

Wire Bond

Lead Frame

RTV Die

Bond

Epoxy

Case

Stainless Steel

Metal Cover

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