| công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
|
TPS1663 bảng dữ liệu(PDF) 6 Page - Texas Instruments |
|
|
|||||||||||||||||||||||||||||
TPS1663 bảng dữ liệu(HTML) 6 Page - Texas Instruments |
|
6 / 46 page ![]() 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT IN, P_IN, OUT, UVLO, FLT, PGOOD Input Voltage –0.3 67 V IN, P_IN (10-ms transient), TA = 25℃ –0.3 75 OVP, dVdT, IMON, MODE, SHDN, ILIM –0.3 5.5 IFLT, IdVdT, IPGOOD Sink current 10 mA IdVdT, IILIM, IPLIM, IMODE, ISHDN Source current Internally limited TJ Operating Junction temperature –40 150 °C Transient junction temperature –65 T(TSD) Tstg Storage temperature –65 150 (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/ JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT IN, P_IN Input voltage 4.5 60 V OUT, UVLO, PGOOD, FLT 0 60 OVP, dVdT, IMON, MODE 0 4 SHDN 0 5 ILIM Resistance 3 30 kΩ PLIM 60.4 150 IMON 1 IN, P_IN, OUT External capacitance 0.1 µF dVdT 10 nF TJ Operating junction temperature –40 25 125 °C 7.4 Thermal Information THERMAL METRIC(1) TPS1663 UNIT RGE (VSON) PWP (HTSSOP) 24 PINS 20 PINS RθJA Junction-to-ambient thermal resistance 31.4 32.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 23.2 23.4 °C/W RθJB Junction-to-board thermal resistance 10.2 10 °C/W TPS1663 SLVSET9F – SEPTEMBER 2018 – REVISED FEBRUARY 2023 www.ti.com 6 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TPS1663 |
|
Link URL |
| Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không? [ DONATE ] |
Alldatasheet là | Quảng cáo | Liên lạc với chúng tôi | Chính sách bảo mật | Liên kết đến bảng dữ liệu | Trao đổi link | Tìm kiếm theo nhà sản xuất All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |