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STLD20D bảng dữ liệu(PDF) 23 Page - STMicroelectronics

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STLD20D bảng dữ liệu(HTML) 23 Page - STMicroelectronics

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STLD20D
Layout recommendation
23/31
10
Layout recommendation
The package connection of the STLD20D has been realized in order to facilitate the layout
of the PCB. The golden rule to obtain an optimized layout is to split the power and signal track
as shown on the
Figure 24.
It is necessary to place the input capacitor as closed as possible between pin1 and pin2 of
the STLD20D package. If the CIN capacitor is not closed to the device, high frequency noise
due to gate driver dI/dt flows through the copper track of the board and can generate some
line voltage drop due to the line inductance.
For the same reason, in order to eliminate high frequency current loop, the connection of the
diode (D) and the output capacitor (COUT) must be as close as possible to the internal power
MosFET (SW) (close to pin 8 and 1).
Concerning the signal path, we recommend to create the PCB GND signal from the pin 1
("A" point in the
Figure 24.). Thus all signal references such as feedback and the voltage
across Rset are not disturbed by the power stage.
Figure 24.
Layout suggested
A
GND
VIN
COUT
12
8
D
L
STLD20D
CIN
RSET
SHDN
RLED



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