MAC7101MPV50 datasheet(10/56 Pages) FREESCALE

10 / 56 page

MAC7100 Microcontroller Family Hardware Specifications, Rev. 1.2

Preliminary

Electrical Characteristics

Freescale Semiconductor

3.6.1

Thermal Resistance Simulation Details

Comments:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature,

ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.

3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface

of the board at the center lead. For fused lead packages, the adjacent lead is used.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).

6. Thermal characterization parameter indicating the temperature difference between package top and junction temperature per JEDEC

JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Table 11. Thermal Resistance for Case Outline 983–02, 100 Lead 14x14 mm LQFP, 0.5 mm Pitch

Rating

Environment

Symbol

Value

Unit

Comments

Junction to Ambient (Natural Convection)

Single layer board (1s)

θJA

°C/W

1, 2

Junction to Ambient (Natural Convection)

Four layer board (2s2p)

θJMA

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Single layer board (1s)

θJMA

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Four layer board (2s2p)

θJMA

°C/W

1, 3

Junction to Board

θJB

°C/W

Junction to Case

θJC

7°C/W

Junction to Package Top

Natural Convection

ΨJT

2°C/W

Table 12. Thermal Resistance for Case Outline 987–01, 112 Lead 20x20 mm LQFP, 0.65 mm Pitch

Rating

Environment

Symbol

Value

Unit

Comments

Junction to Ambient (Natural Convection)

Single layer board (1s)

θJA

°C/W

1, 2

Junction to Ambient (Natural Convection)

Four layer board (2s2p)

θJMA

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Single layer board (1s)

θJMA

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Four layer board (2s2p)

θJMA

°C/W

1, 3

Junction to Board

θJB

°C/W

Junction to Case

θJC

7°C/W

Junction to Package Top

Natural Convection

ΨJT

2°C/W

Table 13. Thermal Resistance for Case Outline 918–03, 144 Lead 20x20 mm LQFP, 0.5 mm Pitch

Rating

Environment

Symbol

Value

Unit

Comments

Junction to Ambient (Natural Convection)

Single layer board (1s)

θJA

°C/W

1, 2

Junction to Ambient (Natural Convection)

Four layer board (2s2p)

θJMA

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Single layer board (1s)

θJMA

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Four layer board (2s2p)

θJMA

°C/W

1, 3

Junction to Board

θJB

°C/W

Junction to Case

θJC

7°C/W

Junction to Package Top

Natural Convection

ΨJT

2°C/W

Table 14. Thermal Resistance for Case Outline 1159A-01, 208 Lead 17x17 mm MAP BGA, 1.0 mm Pitch

Rating

Environment

Symbol

Value

Unit

Comments

Junction to Ambient (Natural Convection)

Single layer board (1s)

θJA

°C/W

1, 2

Junction to Ambient (Natural Convection)

Four layer board (2s2p)

θJMA

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Single layer board (1s)

θJMA

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Four layer board (2s2p)

θJMA

°C/W

1, 3

Junction to Board

θJB

°C/W

Junction to Case

θJC

7°C/W

Junction to Package Top

Natural Convection

ΨJT

2°C/W

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