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M93C86 bảng dữ liệu(PDF) 29 Page - STMicroelectronics |
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M93C86 bảng dữ liệu(HTML) 29 Page - STMicroelectronics |
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29 / 31 page ![]() 29/31 M93C86, M93C76, M93C66, M93C56, M93C46 PART NUMBERING Table 29. Ordering Information Scheme Note: 1. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment. The High Reliability Cer- tified Flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest ST sales office for a copy. 2. Used only for Device Grade 3. For a list of available options (speed, package, etc.) or for further information on any aspect of this device, please contact your nearest ST Sales Of- fice. The category of second-Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. Example: M93C86 – W MN 6 T P /S Device Type M93 = MICROWIRE serial access EEPROM Device Function 86 = 16 Kbit (2048 x 8) 76 = 8 Kbit (1024 x 8) 66 = 4 Kbit (512 x 8) 56 = 2 Kbit (256 x 8) 46 = 1 Kbit (128 x 8) Operating Voltage blank = VCC = 4.5 to 5.5V W = VCC = 2.5 to 5.5V R = VCC = 1.8 to 5.5V Package BN = PDIP8 MN = SO8 (150 mil width) MB = UDFDFPN8 (MLP8) DW = TSSOP8 (169 mil width) DS = TSSOP8 (3x3mm body size) Device Grade 6 = Industrial temperature range, –40 to 85 °C. Device tested with standard test flow 7 = Device tested with High Reliability Certified Flow(1). Automotive temperature range (–40 to 105 °C) 3 = Device tested with High Reliability Certified Flow(1). Automotive temperature range (–40 to 125 °C) Packing blank = Standard Packing T = Tape and Reel Packing Plating Technology blank = Standard SnPb plating P or G = ECOPACK® (RoHS compliant) Process(2) /W or /S = F6SP36% |
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