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RT600 bảng dữ liệu(PDF) 91 Page - NXP Semiconductors |
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RT600 bảng dữ liệu(HTML) 91 Page - NXP Semiconductors |
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91 / 171 page  RT600 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors B.V. 2024. All rights reserved. Product data sheet Rev. 2.2 — 25 January 2024 91 of 173 NXP Semiconductors RT600 Dual-core microcontroller with 32-bit Cortex-M33 and Xtensa HiFi4 Audio DSP CPUs 12. Thermal characteristics The average chip junction temperature, Tj (C), can be calculated using the following equation: (1) • Tamb = ambient temperature (C), • Rth(j-a) = the package junction-to-ambient thermal resistance (C/W) • PD = sum of internal and I/O power dissipation The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of the I/O pins is often small and many times can be negligible. However it can be significant in some applications. Determined in accordance to JEDEC JESD51-2A natural convection environment (still air). Thermal resistance data in this report is solely for a thermal performance comparison of one package to another in a standardized specified environment. It is not meant to predict the performance of a package in an application-specific environment. [1] Determined in accordance to JEDEC JESD51-2A natural convection environment (still air). Thermal resistance data in this report is solely for a thermal performance comparison of one package to another in a standardized specified environment. It is not meant to predict the performance of a package in an application-specific environment. Table 19. Thermal resistance [1] Symbol Parameter Conditions Max/Min Unit VFBGA176 Package Rth(j-a) thermal resistance from junction to ambient JESD51-9, 2s2p, still air 32.8 C/W WLCSP114 Package Rth(j-a) thermal resistance from junction to ambient JESD51-9, 2s2p, still air 35.3 C/W FOWLP249 Package Rth(j-a) thermal resistance from junction to ambient JESD51-9, 2s2p, still air 29.6 C/W Tj Tamb PD Rth j a – + = |
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