TSL26713 datasheet(37/45 Pages) OSRAM

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Page 36

ams Datasheet

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[v1-00] 2016-Jul-12

TSL2671 − Manufacturing Information

Soldering Information

The FN package has been tested and has demonstrated an

ability to be reflow soldered to a PCB substrate. The process,

equipment, and materials used in these test are detailed below.

The solder reflow profile describes the expected maximum heat

exposure of components during the solder reflow process of

product on a PCB. Temperature is measured on top of

component. The components should be limited to a maximum

of three passes through this solder reflow profile.

Figure 42:

Solder Reflow Profile

Figure 43:

Solder Reflow Profile Graph

Parameter

Reference

Device

Average temperature gradient in preheating

2.5°C/s

Soak time

tsoak

2 to 3 minutes

Time above 217°C (T1)t1

Max 60 s

Time above 230°C (T2)

Max 50 s

Time above Tpeak −10°C (T3)t3

Max 10 s

Peak temperature in reflow

Tpeak

260°C

Temperature gradient in cooling

Max −5°C/s

Manufacturing Information

tsoak

Tpeak

Not to scale — for reference only

Time (s)

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