TMD2635 datasheet(5/48 Pages) OSRAM

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[v2-00] 2023-Jan-04

TMD2635 − Absolute Maximum R atings

Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. These are stress

ratings only. Functional operation of the device at these or any

other conditions beyond those indicated under Electrical

Characteristics is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device

reliability.

Figure 5:

Absolute Maximum Ratings

Note(s):

1. The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow

Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices.”

Symbol

Parameter

Min

Max

Units

Comments

VDD

Supply voltage to GND

-0.3

2.0

VDD3

IR emitter voltage to GND

-0.3

3.6

VIO

Digital I/O terminal voltage

-0.3

3.6

IIO

Digital output terminal voltage

-1

ISCR

Input current (latch up immunity)

±100

Class II JEDEC JESD78E

ESDHBM

HBM Electrostatic discharge

±2000

JEDEC/ ESDA JS-001-2017

ESDCDM

CDM Electrostatic discharge

±500

JEDEC JS-002-2014

TSTRG

Storage temperature range

-40

°C

TBODY

Package body temperature

260

°C

IPC/JEDEC J-STD-020 (1)

RHNC

Relative humidity

(non- condensing)

585

PDISS

Power dissipation

Average power dissipation

over a 1 second period

Absolute Maximum Ratings

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