TCS34727FN datasheet(33/41 Pages) OSRAM

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Page 32

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[v1-04] 2020-Apr-10

TCS3472 − Soldering & Storage Information

Soldering Information

The FN package has been tested and has demonstrated an

ability to be reflow soldered to a PCB substrate. The process,

equipment, and materials used in these test are detailed below.

The solder reflow profile describes the expected maximum heat

exposure of components during the solder reflow process of

product on a PCB. Temperature is measured on top of

component. The components should be limited to a maximum

of three passes through this solder reflow profile.

Figure 39:

Solder Reflow Profile

Figure 40:

Solder Reflow Profile Graph

Note(s):

1. Not to scale – for reference only.

Parameter

Reference

Device

Average temperature gradient in preheating

2.5ºC/s

Soak time

tsoak

2 to 3 minutes

Time above 217ºC (T1)t1

Max 60 s

Time above 230ºC (T2)t2

Max 50 s

Time above Tpeak - 10ºC (T3)t3

Max 10 s

Peak temperature in reflow

Tpeak

260ºC

Temperature gradient in cooling

Max -5ºC/s

Soldering & Storage

Information

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