© Koninklijke Philips Electronics N.V. 2002.

Printed in the U.S.A

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner.

The information presented in this document does not form part of any quotation or

contract, is believed to be accurate and reliable and may be changed without notice. No

liability will be accepted by the publisher for any consequence of its use. Publication

thereof does not convey nor imply any license under patent- or other industrial or

intellectual property rights.

Date of release: 09 May 2002

Document order number: 9397 750 09646

Contents

Philips Semiconductors

PCF85103C-2

256

1

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3

Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

4

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

5

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6

Pinning information . . . . . . . . . . . . . . . . . . . . . . 4

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7

Device addressing . . . . . . . . . . . . . . . . . . . . . . . 4

8

Functional description . . . . . . . . . . . . . . . . . . . 6

8.1

I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . . 6

8.1.1

Bus conditions . . . . . . . . . . . . . . . . . . . . . . . . . 6

8.1.2

Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8.1.3

Device addressing . . . . . . . . . . . . . . . . . . . . . . 7

8.1.4

Write operations . . . . . . . . . . . . . . . . . . . . . . . . 7

8.1.5

Read operations . . . . . . . . . . . . . . . . . . . . . . . . 9

9

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10

10

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10

11

I2C-bus characteristics . . . . . . . . . . . . . . . . . . 11

12

Write cycle limits . . . . . . . . . . . . . . . . . . . . . . . 12

13

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13

14

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

14.1

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 15

14.2

Surface mount packages . . . . . . . . . . . . . . . . 15

14.2.1

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 15

14.2.2

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 15

14.2.3

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 16

14.3

Through-hole mount packages . . . . . . . . . . . . 16

14.3.1

Soldering by dipping or by solder wave . . . . . 16

14.3.2

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 16

14.4

Package related soldering information . . . . . . 17

15

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18

16

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19

17

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

18

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

19

Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19