PCF50732 datasheet(2/64 Pages) PHILIPS

2 / 64 page

1999 May 03

Philips Semiconductors

Objective speciﬁcation

Baseband and audio interface for GSM

PCF50732

CONTENTS

FEATURES

APPLICATIONS

GENERAL DESCRIPTION

ORDERING INFORMATION

QUICK REFERENCE DATA

BLOCK DIAGRAM

PINNING

FUNCTIONAL DESCRIPTION

8.1

General

8.2

Baseband and voice band reference voltages

BASEBAND CODEC

9.1

Baseband transmit path

9.2

Baseband receive path

9.3

Baseband Serial Interface (BSI)

VOICE BAND CODEC

10.1

Voice band receive path

10.2

Voice band transmit path

10.3

Voice band digital circuitry

AUXILIARY FUNCTIONS

11.1

Automatic Gain Control (AGC): AUXDAC1

11.2

Automatic Frequency Control (AFC):

AUXDAC2

11.3

Power ramping: AUXDAC3

11.4

Auxiliary analog-to-digital converter (AUXADC)

CONTROL SERIAL INTERFACE (CSI)

12.1

The serial interface

12.2

Control Serial Interface (CSI) timing

characteristics

12.3

Control register block

VOICE BAND SIGNAL PROCESSOR (VSP)

13.1

Hardware description

13.2

VSP assembler language

13.3

Descriptions of the VSP instruction set

13.4

The assembler/emulator

LIMITING VALUES

THERMAL CHARACTERISTICS

DC CHARACTERISTICS

AC CHARACTERISTICS

FUNCTIONAL CHARACTERISTICS

18.1

Baseband transmit (BSI to TXI/Q)

18.2

Baseband receive (RXI/Q to BSI)

18.3

Voice band transmit (microphone to ASI)

18.4

Voice band receive (ASI to earphone)

18.5

Auxiliary digital-to-analog converters

18.6

Auxiliary analog-to-digital converters:

AUXADC1, AUXADC2, AUXADC3 and

AUXADC4

18.7

Typical total current consumption

18.8

Typical output loads

APPLICATION INFORMATION

19.1

Wake-up procedure from Sleep mode

19.2

Microphone input connection and test set-up

PACKAGE OUTLINES

SOLDERING

21.1

Introduction to soldering surface mount

packages

21.2

Reflow soldering

21.3

Wave soldering

21.4

Manual soldering

21.5

Suitability of surface mount IC packages for

wave and reflow soldering methods

DEFINITIONS

LIFE SUPPORT APPLICATIONS

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