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MXT641T bảng dữ liệu(PDF) 13 Page - ATMEL Corporation

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mXT641T 1.0 [Datasheet]
9917JX–AT42–02/15
Schematic
3.1
Schematic Notes
CAUTION: The device may be permanently damaged if any XVDD pin is shorted to ground or high current is
drawn from it.
3.1.1
Decoupling capacitors:
1.
Decoupling capacitors must be X7R or X5R and placed <5 mm away from the pins for which they act as bypass
capacitors.
2.
The schematics show the minimum capacitors required. If the ball configuration means that sharing a bypass
capacitor is not possible, then the number of capacitors should be increased.
3.
If the device is placed on the system board, the minimum number of capacitors required is as shown in the
schematic on page 12. Note that this requires that the voltage regulator supplies for AVDD/VDD and VDDIO are
clean and noise free. It also assumes that the track length between the capacitors and on-board power supplies is
< 50 mm.
4.
If an active tail design is used, the voltage regulators are likely to be some distance from the device and it may be
necessary to implement additional decoupling. In this case, a parallel combination of capacitors is recommended
to give high and low frequency filtering, as shown in Figure 3-1.
Figure 3-1. Additional Recommended Decoupling Capacitors
3.1.2
VDDCORE
VDDCore is internally generated from the Vdd 3.3 V power supply. To guarantee stability of the internal voltage regulator,
a minimum value of 1 µF must be used for decoupling on VDDCORE.
3.1.3
RESET Line
The RESET line is shown on the schematics with a 10 nF capacitor (Creset) to ground. This capacitor is optional but may
help if ESD issues are encountered.
GND
GND
22 nF
2.2 µF
AVDD
VDD
VDDIO
2.2 µF
22 nF
22 nF
1 µF
22 nF
NOTE: Recommended additional decoupling capacitors are shown in blue
22 nF
2.2 µF
GND
GND
GND
GND



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