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AM29LV200B bảng dữ liệu(PDF) 8 Page - Advanced Micro Devices |
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AM29LV200B bảng dữ liệu(HTML) 8 Page - Advanced Micro Devices |
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8 / 11 page ![]() 8 Am29LV200B Known Good Die November 18, 2003 SU PP L E ME NT PRODUCT TEST FLOW Figure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29LV200B product qualification database. AMD implements quality assurance procedures throughout the product test flow. These QA procedures also allow AMD to produce KGD products without requiring or implementing burn-in. In addition, an off-line qualifica- tion maintenance program (QMP) further guarantees AMD quality standards are met on Known Good Die products. Figure 1. AMD KGD Product Test Flow Wafer Sort 1 Bake 24 hours at 250 °C Wafer Sort 2 Wafer Sort 3 High Temperature Packaging for Shipment Shipment DC Parameters Functionality Programmability Erasability Data Retention DC Parameters Functionality Programmability Erasability DC Parameters Functionality Programmability Erasability Speed Incoming Inspection Wafer Saw Die Separation 100% Visual Inspection Die Pack |
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