18

Am29BL162C Known Good Die

SU PPL EMEN T

REVISION SUMMARY

Revision A (June 7, 2000)

Initial release.

Revision A+1 (December 19, 2000)

Corrected reference to BL162C data sheet publication

number.

Ordering Information

Added quantities for Waffle Pack, Gel-Pak, and Sur-

ftape.

Revision A+2 (September 11, 2002)

Moved Pad 11 on Die Pad Locations Diagram

Added Pad 52 to Pad Description Tables (Relative to

Pad 1 and Relative to Die Center)

Revision A+2 (September 11, 2002)

Changed title from Boot Sector Flash to Burst-mode,

Boot Sector Flash.

Product Selector Guide

Removed Note #2.

AC Characteristics

Added Read Operations, Burst Mode Read, and Erase/

Program Operations and Alternate CE# Controlled

Erase/Program Operations Tables.

Revision A + 3 (April 29, 2003)

Product Test Flow

Replaced text preceding Figure 1.

Trademarks

Copyright © 2003 Advanced Micro Devices, Inc. All rights reserved.

AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.

Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.