AM29LV002BT-55REF datasheet(40/41 Pages) AMD

40 / 41 page

Am29LV002B

21520D5 October 11, 2006

D A TA SH EET

REVISION SUMMARY

Revision A (January 1998)

Released initial, abbreviated version.

Revision B (June 1998)

Expanded data sheet from Advanced Information to

Preliminary version.

Distinctive Characteristics

Changed “Manufactured on 0.35 µm process technology”

to “Manufactured on 0.32 µm process technology”.

General Description

Second paragraph: Changed “This device is manufac-

tured using AMD’s 0.35 µm process technology” to

“This device is manufactured using AMD’s 0.32 µm

process technology”

Revision B+1 (August 1998)

Global

Added the -55R speed option; deleted the -80 speed

option.

DC Characteristics

Added the note on maximum ICC specifications to

table.

AC Characteristics

Alternate CE# Controlled Erase/Progran Operations:

Corrected the -90 tCP specification.

Revision C (January 1999)

Distinctive Characteristics

Added bullet for 20-year data retention at 125

°C

AC Characteristics—Erase/Program Operations

tDVWH: Changed the -55R speed option to 35 ns from

20 ns.

tWLWH: Changed the -55R speed option to 35 ns from

30 ns.

AC Characteristics—Alternate CE# Controlled

Erase/Program Operations

tDVEH: Changed the -55R speed option to 35 ns from 20

ns.

TSOP Pin Capacitance

Changed from “TSOP and SO Pin Capacitance”.

Revision D (November 18, 1999)

AC Characteristics—Figure 15. Program

Operations Timing and Figure 16. Chip/Sector

Erase Operations

Deleted tGHWL and changed OE# waveform to start at

high.

Physical Dimensions

Replaced figures with more detailed illustrations.

Revision D+1 (November 13, 2000)

Added table of contents. Deleted burn-in option from

Ordering Information section.

Revision D+2 (June 14, 2004)

Added Pb-free package OPNs.

Revision D+3 (January 5, 2006)

Removed all Reverse TSOP options.

Revision D+4 (September 12, 2006)

Erase and Program Operations table

Changed tBUSY to a maximum specification.

Revision D5 (October 11, 2006)

Global

Added notice on product availability.

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