© Koninklijke Philips Electronics N.V. 2001.

Printed in The Netherlands

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner.

The information presented in this document does not form part of any quotation or

contract, is believed to be accurate and reliable and may be changed without notice. No

liability will be accepted by the publisher for any consequence of its use. Publication

thereof does not convey nor imply any license under patent- or other industrial or

intellectual property rights.

Date of release: 30 November 2001

Document order number: 9397 750 08872

Contents

Philips Semiconductors

ISP1105/1106/1107

Advanced USB transceivers

1

General description . . . . . . . . . . . . . . . . . . . . . . 1

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

4.1

Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2

5

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3

6

Pinning information . . . . . . . . . . . . . . . . . . . . . . 4

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

7

Functional description . . . . . . . . . . . . . . . . . . . 6

7.1

Function selection. . . . . . . . . . . . . . . . . . . . . . . 6

7.2

Operating functions. . . . . . . . . . . . . . . . . . . . . . 7

7.3

Power supply configurations . . . . . . . . . . . . . . . 7

7.4

Power supply input options . . . . . . . . . . . . . . . . 8

8

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9

9

Static characteristics. . . . . . . . . . . . . . . . . . . . 10

10

Dynamic characteristics . . . . . . . . . . . . . . . . . 13

11

Test information . . . . . . . . . . . . . . . . . . . . . . . . 15

12

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16

13

Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

14

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

14.1

Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

14.2

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 19

14.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 19

14.4

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 20

14.5

Package related soldering information . . . . . . 20

15

Additional soldering information . . . . . . . . . . 21

15.1

(H)BCC packages: footprint . . . . . . . . . . . . . . 21

15.2

(H)BCC packages: reflow soldering profile . . . 21

16

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22

17

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 23

18

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

19

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23